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IPC-7351 Footprint Generator (KiCad)

Generate an IPC-7351 compliant PCB footprint from body/pad dimensions. Downloads as a KiCad `.kicad_mod` file. No AI, no upload, no signup.

PRESETS:
Result
3.18 mm span · 1.62 × 0.68 mm pads
IPC-7351B density N · 8-pin, 1.27 mm pitch
Pad length
1.620 mm
Pad width (X)
0.680 mm
Outer span (Z)
4.800 mm
Inner clearance (G)
1.560 mm
Toe goal (J_T)
0.35 mm
Heel goal (J_H)
0.35 mm
Footprint ready — 8-pin, 1.27 mm pitch, IPC-N. Place it on a real board →
Method & assumptions

Land pattern per IPC-7351B. Pad dimensions computed from body and lead geometry using the standard toe/heel/side goals for the chosen density level:

  • L (Least density) — hand solder, wave solder, most robust
  • N (Nominal, default) — most PCBs, reflow-friendly
  • M (Most density) — HDI, machine-only assembly

Output is a KiCad 6+ .kicad_mod file with pads on F.Cu, silkscreen pin-1 dot, and Fab-layer body outline.

What IPC-7351 defines

IPC-7351B is the industry standard for surface-mount land patterns. It defines the relationship between the physical component (body, lead length, lead width) and the copper pads it lands on. Three density levels balance manufacturability against board area: L for prototype and rework, N for volume production, M for smallest form factor.

Presets vs. custom dimensions

Common SOIC and TSSOP presets are included. For any part not in the presets, enter the four dimensions from the datasheet: body length (L), body width (W), lead length, and lead width. Body length is the direction perpendicular to the leads; body width includes the leads.

Frequently asked

What is IPC-7351?
IPC-7351B is the industry standard for surface-mount PCB land patterns. It defines pad size and position from component dimensions and density level, so footprints from different sources are dimensionally consistent.
Which package types does this generator support?
Dual-row gullwing packages — SOIC, SOP, SSOP, TSSOP, and QFP-class dual-row parts. QFN, BGA, and non-standard packages require different formulas and are not covered by this generator.
What is density level L vs N vs M?
L (Least) gives the largest, most robust pads for hand-soldering. N (Nominal) is the default for most reflow production. M (Most) gives the smallest pads for HDI machine-only assembly.
Can I use the output in KiCad?
Yes. Download the .kicad_mod file and drop it into a KiCad footprint library folder. It uses the KiCad 6+ file format.
Next step

Use PCBEditor's AI-native editor to take this from a calculation to a real, fabricable board.

Place this footprint on a real board →
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